EN 
EN
DA
NL
FI
FR
DE
IT
JA
KO
NO
PL
PT
RO
RU
ES
SV
TL
ID
SK
UK
VI
TH
TR
FA
BE
LA
UZ
Mphete Zoyang'ana za CVD Solid SiC
Mphete zoyang'ana za Semixlab za CVD solid SiC zimapangidwa kuti zigwiritsidwe ntchito m'malo apamwamba oyeretsera plasma, kupereka kukhazikika kwapadera kwa plasma, kuipitsidwa kochepa kwambiri, komanso moyo wautali wautumiki. Zopangidwa pogwiritsa ntchito high-density chemical vapor deposition (CVD) silicon carbide, mphete zoyang'ana izi zimapereka kukana kwakukulu ku kuwonongeka kwa plasma ndi kuukira kwa mankhwala, zomwe zimapangitsa kuti zikhale zoyenera kwambiri popanga semiconductor. Tikuyembekezera kufunsa kwanu kwina.
Kufotokozera
Kukonza Tsogolo la Sub-7nm Etch Yield99.99999% Ultra-High Purity | Stable HAR Etching | Njira Yabwino Kwambiri M'malo mwa Mphete za Silicon
Mu zaka zoposa 300 za ma transistors a 3D NAND ndi GAA, zinthu zogwiritsidwa ntchito mwachizolowezi ndiye chifukwa chachikulu cha mavuto a yield. Mphete za Semixlab zokhazikika za CVD SiC zimapangidwa kuti zigwire plasma yochuluka kwambiri yomwe imafunika kuti pakhale chiŵerengero chapamwamba cha zinthu (HAR). Zimapanga malo okhazikika, opanda tinthu tating'onoting'ono tomwe mphete za silicon (Si) sizingapereke.
Muyezo wa Makampani: Chifukwa Chake Kutsogolera Kusintha kwa Fabs Kupita ku Solid SiC
7-Nines (99.99999%) Metallic Purity: Pogwiritsa ntchito njira yathu yapadera yochotsera nthunzi ya Advanced Chemical Vapor Deposition, timapeza zonyansa zonse zachitsulo <0.1 ppm. Izi zimathandiza kwambiri kupewa zolakwika zokhudzana ndi charge ndi kuipitsa kwa heavy metal mu logic ndi memory chips zapamwamba.
Kuwongolera kwa Precision Edge Roll-off (ERO): Mphete zathu zolimba za SiC zimasunga kukana kwamagetsi kokhazikika komanso kutentha kwambiri (≥ 150 W/m·K). Izi zimapangitsa kuti plasma sheath ikhale yofanana pamphepete mwa wafer.
Izi zimathetsa mwachindunji mavuto a Edge Roll-off omwe amakhudza kufanana kwa wafer wa mainchesi 12.
Kukana Kukugwa kwa HAR Etching: Mu plasma yokhala ndi mphamvu zambiri ya Fluorine (CF4/CHF3) ndi Chlorine (Cl2), Solid SiC imawonetsa kuchuluka kwa kukokoloka kwa nthaka ndi 80% kotsika kuposa Silicon imodzi. Izi zimawonjezera nthawi ya PM (Preventative Maintenance), zomwe zimachepetsa kwambiri Mtengo Wonse wa Umwini (CoO).
Umphumphu wa "Solid" wa Monolithic: Mosiyana ndi Graphite yokhala ndi SiC, ziwalo zathu ndi 100% zokhuthala za SiC. Izi zimachotsa chiopsezo cha Micro-cracking kapena Coating Delamination, zomwe zimaletsa kuwonongeka kwa tinthu tating'onoting'ono panthawi ya etch yamphamvu kwambiri.
Yokonzedweratu Mapulatifomu a Next-Gen Etch
Malo athu opangira zinthu amagwiritsa ntchito 5-axis High-Speed CNC ndi Laser Metrology kuti atsimikizire kuti akugwirizana ndi zofunikira za OEM 100% pa:
● Kujambula Kondakitala: Kujambula Poly-Si ndi Silicide.
● Kujambula kwa Dielectric: Kukhudza kwa High Aspect Ratio (HAR) ndi kukongoletsa ngalande.
● Kugwirizana: Kulowa m'malo mwa Lam Research (Kiyo/Versys), Applied Materials (Centris), ndi TEL (Tactras/Vigus).
zofunika
| Zojambula Zamakono | Semixlab CVD Solid SiC | Chizindikiro cha Makampani (Si) | Mpikisano Wampikisano |
| Chemical Purity | 99.99999% (7N) | 99.999% (5N) | Amachotsa kutuluka kwa ayoni |
| Mapangidwe a Gawo | 100% β-SiC (Cubic) | Crystal Si imodzi | Kukana kwa Isotropic etch |
| Kukula kwachibale | ≥99.8% (3.20 g/cm3) | N / A | Kapangidwe ka zero-porosity |
| Vickers Kuuma | 28-30 GPA | ~ 9 pa | Amalimbana ndi kuphulika kwa ma ion |
| Kukhwima Kwambiri | Kulemera <0.2 μm | Ra ~0.5μm | Kumamatira kochepa kwa polima |
Mapulogalamu
Minda Yofunika Kwambiri
Pamene pakufunika kuyera kwambiri komanso kulimba kwa plasma, CVD Solid SiC yathu imayimira muyezo wamakampani:
● Kukulitsa 3D NAND ndi DRAM: Yapangidwira zovuta za kupeta kwa HAR (High Aspect Ratio). Imapereka kukhazikika kofunikira kuti ipete m'magawo opitilira 300 popanda kusokoneza mbiri.
● Ma Sub-7nm Logic Nodes: Makamaka pa zomangamanga za FinFET ndi GAA. Timathandiza opanga zinthu kuchotsa kuipitsidwa kwa zitsulo zochepa, kuteteza lattice yofewa ya ma transistors a m'badwo wotsatira.
● Malo Opangira Ma Semiconductor a Mphamvu: Kaya ndi SiC epitaxy kapena deep trench etching ya GaN, ziwalo zathu zimatha kugwira ntchito yotenthetsera kwambiri chifukwa cha kupanga ma bandgap ambiri.
● TSV & Ma phukusi Apamwamba: Yokonzedwa bwino kuti igwiritsidwe ntchito pa njira za Through-Silicon Via, kuonetsetsa kuti mbali ya khoma ndi yolondola kwambiri ndizofunikira kuti pakhale kuphatikiza kwa 2.5D/3D.
Services wathu
